Wet processes

Wet Process Wafer Chucks (WPWC )
+ Wafer Chuck for Uniform Electrodeposition (WEDC )

Wet processing wafer chucks for back-side protection during wet etching or electrodeposition: We fabricate chucks for wafer diameters between 2" and 200 mm and desired thickness. Custom chucks can be fabricated upon request. Chucks for KOH and HF etching as well as immersion into other chemicals can be fabricated. Chucks with an integrated ring electrode homogenize the current density distribution on the wafer during galvanic deposition processes. Wafer chuck carriers for multiple wet processing wafer chucks can be designed to your needs. Most carriers were designed to fit exactly into our clients etching equipment.

Hereafter, we list some of the standard chemicals used in wet etching microfabrication processes, and compatible with the WPWC:

  • HF (Hydrofluoric acid)
  • KOH (Potassium hydroxide)
  • TMAH (Tetramethylammonium hydroxide)
For further details on chemicals compatibility, please get in touch with our sales team.


WPWC product brochure (PDF).

WEDC product brochure (PDF).

Click here to see more pictures of the WPWC, WEDC, and chuck carriers.

Ask for a quotation

Please note that we do not publish any price list online.

If you are interested in one of our products, please contact us to get a quotation (either through one of our sales partners, or directly to our headquarters).

If you feel that one of our standard products would need adaption work to suit your application, please do not hesitate to ask us for advice on engineering work. We can find solutions.