Precise alignment and bonding of two single chips is very often needed for building three dimensional structures or packaging in MEMS fabrication.
With the chip to chip bonder, it becomes possible to align two chips manually. The chips can then be brought into contact in order to perform anodic bonding or various gluing processes. The single chip alignment stage includes three linear axes and three rotation axes, which provide enough degrees of freedom for most alignment applications.
The lower chip is clamped on a base plate, the upper chip is held by a needle. Both vacuum holders can be adjusted and switched separately. In order to perform the anodic bonding process, a heating plate as well as a high voltage source are provided. The bond-voltage is adjusted on a controller unit, which monitors the voltage and the bond-current. The temperature of the heating plate is also adjusted on the controller unit.