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  • Wafer Bonding Inspection Device
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    • Photovoltaic Manufacturing Equipment
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      • HF Vapor Phase Etcher
      • Infrared Microscope
      • Wet Process Wafer Chucks
      • Electrostatic Chucks
      • Shadow Mask Aligner
      • Multiple Chip Vacuum Chuck
      • Wafer Bonding Inspection Device
      • Chip to Chip Bonder
      • UV LED Exposure System

Wafer bonding inspection device



 

Applications

Examples of IR-images: The left image shows two silicon wafers after fusion bonding (picture courtesy of CSEM SA). The total thickness is 1.0 mm. The un-bonded areas between the two wafers are visualized by the inference patterns. The right image shows a bonding of pre-structured wafers. The regular pattern consists of etched cavities. The interference pattern at the border also indicates a bad bonding in this area.



 
  • Technologies
  • Engineering services
  • Manufacturing services
  • Products
    • Photovoltaic Manufacturing Equipment
    • Optics and Machine Vision
    • Surface Treatment by Ion Implantation
    • MEMS Manufacturing Equipment
      • HF Vapor Phase Etcher
      • Infrared Microscope
      • Wet Process Wafer Chucks
      • Electrostatic Chucks
      • Shadow Mask Aligner
      • Multiple Chip Vacuum Chuck
      • Wafer Bonding Inspection Device
      • Chip to Chip Bonder
      • UV LED Exposure System
Idonus Sarl
Rouges-Terres 61
2068 Hauterive / Neuchatel
Switzerland
+41 32 724 44 40
info@idonus.com
www.idonus.com
Copyright 2019 - idonus sarl
  • Technologies
  • Engineering services
  • Manufacturing services
  • Products
    • Photovoltaic Manufacturing Equipment
    • Optics and Machine Vision
    • Surface Treatment by Ion Implantation
    • MEMS Manufacturing Equipment
      • HF Vapor Phase Etcher
      • Infrared Microscope
      • Wet Process Wafer Chucks
      • Electrostatic Chucks
      • Shadow Mask Aligner
      • Multiple Chip Vacuum Chuck
      • Wafer Bonding Inspection Device
      • Chip to Chip Bonder
      • UV LED Exposure System