Wafer bonding inspection device



Examples of IR-images: The left image shows two silicon wafers after fusion bonding (picture courtesy of CSEM SA). The total thickness is 1.0 mm. The un-bonded areas between the two wafers are visualized by the inference patterns. The right image shows a bonding of pre-structured wafers. The regular pattern consists of etched cavities. The interference pattern at the border also indicates a bad bonding in this area.