UV-LED photolithography exposure
Modular alignment systems
Infrared (IR) microscope
HF Vapor Phase Etchers
Electrostatic chucks
Wafer chucks for wet processes
Wafer bonding inspection
Chip-to-chip anodic bonder
Other products


The idonus core products are cleanroom equipment for MEMS microfabrication.

On this page, we have classified these products in two categories of equipment:

  • Mask alignment (MAS, DIM ) and photolithography exposure (UV-EXP ), and the combination of both (PLX )
  • Systems for MEMS microfabrication (VPE, E-chuck, WPWC, CCB ) and inspection (IR-M, WBI )

Mask aligner and photolithography

Mask Alignment solutions (MAS )

  • Shadow Mask Aligner
  • Double Image Microscope (DIM )
  • Mask Aligner with DIM (MAS + DIM )

UV-LED Exposure Systems
(UV-EXP series)

A wide range of exposure systems with the UV-EXP series:

  • UV-EXP150R: Ø150 mm exposure area
  • UV-EXP150S: 150 × 150 mm² exposure area
  • UV-EXP200R
  • UV-EXP200S
  • UV-EXP300S

Entry-level product: UV-LAB100R

Hg-vapor lamp retrofitting and customized designs:

  • UV-EXP600S: Very large exposure area 600 × 600 mm² (implies customized design for systemintegration)
  • Retrofitting of Hg-based mask aligners
  • Customized mounting base using standard UV-EXP products
  • Customized design of UV-EXP for other dimensions (e.g., size < 150R)

Photolithography Exposure
(PLX series)

PLX are complete systems combining alignment and UV exposure. The PLX series combines the MAS + DIM with the UV-EXP equipment.

  • PLX150: with a UV-EXP150R or UV-EXP150S
  • PLX200: with a UV-EXP200R or UV-EXP200S

MEMS microfabrication

HF Vapor Phase Etcher (VPE series)

VPE series:

  • VPE100: up to Ø100 mm wafers
  • VPE150
  • VPE200
Other variants and a wide range of accessories

Electrostatic chuck (E-chuck)

Electrostatic clamping of multiple chips or parts of wafers

Wet Process Wafer Chucks (WPWC ) +
Wafer Chuck for Uniform Electrodeposition (WEDC )

Mechanical chucks for wafers chemical etching or for uniform electrodeposition

Chip to chip bonder (CCB )

System for the anodic bonding of dies

MEMS inspection

Infrared Microscope (IR-M )

Microscope with IR sensitive camera

Wafer bonding inspection (WBI )

Inspection of full wafers (e.g., after fusion bonding) by means of Infrared (IR) imaging

Other products

  • Multiple chip vacuum chuck
  • End-of-life (EOF) products are availabe only for clients that had previously purchased these products

Ask for a quotation

Please note that we do not publish any price list online.

If you are interested in one of our products, please contact us to get a quotation (either through one of our sales partners, or directly to our headquarters).

If you feel that one of our standard products would need adaption work to suit your application, please do not hesitate to ask us for advice on engineering work. We can find solutions.