Wafer bonding inspection (WBI ) equipment
Silicon is transparent for infrared (IR) light. Our IR light wafer bonding inspection device (WBI ) illuminates the silicon substrate from the back-side and captures the light that permeates the substrate. Therefore, it becomes possible to inspect phenomena between two silicon substrates, which are not visible from the outside.
Detail of the WBI.
Note that the drawer is adaptable to any wafer size.
The idonus WBI (computer not shown).
Examples of inspection results
Examples of IR images: The first picture shows two silicon wafers after fusion bonding (picture courtesy of CSEM SA). The total thickness is 1.0 mm. The unbonded areas between the two wafers are visualized by the interference patterns. The second picture shows a bonding of pre-structured wafers. The regular pattern consists of etched cavities. The interference pattern at the border also indicates a bad bonding in this area.
"Ti/Si interface enabling complementary metal oxide semiconductor compatible, high reliable bonding for inter-die micro-fluidic cooling for future advanced 3D integrated circuit integration,"
H. K. Cheemalamarri et al., Journal of Micromechanics and Microengineering, vol. 30, 105005, 2020.
"Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration,"
A. K. Panigrahi et al.,
5th Int. Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2017, pp. 35-35.
Ask for a quotation
Please note that we do not publish any price list online.
If you are interested in one of our products, please contact us to get a quotation (either through one of our sales partners, or directly to our headquarters).
If you feel that one of our standard products would need adaption work to suit your application, please do not hesitate to ask us for advice on engineering work. We can find solutions.
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