Electrostatic chucks (E-chucks )

The electrostatic chuck is able to clamp multiple chips as well as parts of a wafer to the wafer holder by electrostatic force.

This device is extremely useful for R&D institutions, where working on complete wafers is not always possible. Electrostatic clamping of chips allows to perform the harsh dicing process of MEMS wafers before the HF vapor release. By modifying the classical fabrication sequence, it becomes possible to produce MEMS devices with extremely soft suspensions.

The usage of the electrostatic chuck is very simple. The chips are placed on the wafer holder and the electric force is turned on by a switch on the controller box. The electrostatic force can be adjusted.

For further details on this equipment, please check the "download" section of the VPE page.



Electrostatic chuck

The electrostatic chuck can be used either for whole wafer clamping of for electrostatic clamping of individual chips.




Ask for a quotation

Please note that we do not publish any price list online.

If you are interested in one of our products, please contact us to get a quotation (either through one of our sales partners, or directly to our headquarters).

If you feel that one of our standard products would need adaption work to suit your application, please do not hesitate to ask us for advice on engineering work. We can find solutions.