Mask Alignment System with Double Image Microscope (MAS + DIM )
The mask aligner is designed to accurately align masks with substrates. Using for example a shadow mask permits to do a lithography free thin film deposition. Once the wafer aligned under the mask the two substrates will be clamped in a double chuck. The clamped double chuck with substrates can then be inserted in PVD chamber for evaporation. After the deposition the double chuck will be separated and the substrates can be taken out.
idonus MAS+DIM: Both systems can be combined.